We have heard a number of rumors about the new Samsung Galaxy S7 smartphone, the latest one suggests that the handset will feature heat pipes.
Samsung are expected to release the handset with two different processors, their new Exynos 8990 processor and also the new Qualcomm Snapdragon 820 processor.
Samsung dropped the Snapdragon 810 from this years Galaxy S6 due to overheating issues and they are now looking to make sure that the Snapdragon 820 doesn’t have the same problems.
According to a recent report, Samsung are looking into using heat pipes for improved heat dissipation in the Galaxy S7, although Qualcomm has said that there are no overheating issues with their Snapdragon 820 processor.
There are rumored to be a number of different versions of the Galaxy S7, one with a flat display, the other with a curved display which will apparently launch as the Galaxy S7 Edge.
The Samsung Galaxy S7 is rumored to come with a 5.2 inch display and the Galaxy S7 Edge a 5.7 inch display, both handset are expected to have a Quad HD resolution of 2560 x 1440 pixels. There is also rumors of another version of the handset with a 4K display.
Samsung are rumored to announce their new Galaxy S7 some time in January and then launch the handset in February, this is slightly earlier than they normally launch their new device.
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