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New Moto X Smartphones To Have Modular Backplate Design

10:08 am May 10, 2016 By Roland Hutchinson

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New Moto X

Yesterday we saw some leaked photos of the new Moto X and Moto X Plus smartphones and now we have some more information on the two handsets.

As you can see in the picture above there are 16 small holes on the back of the handset and now Evan Blass has revealed that these tiny holes are connector ports and that the new Motorola smartphones have a modular design.

The ports on the back of the handset will connect new modular accessories called ‘Amps’ and there will be a number of add on accessories for the handset from both Motorola and third party manufacturers.

The modules will apparently include a speaker pack, a battery pack, a camera grip with a built in flash, a pico projector and also a rugged cover for the handset.

As we can see in the photo above the camera module sticks out from the back of the device, when the modular accessories are in place this will sit flush with the accessory.

It looks like we also have some more specifications on the two Moto X handsets, one is called the Vector Thin, the other is called the Vertex.

The Vector Thin will have a 5.5 inch Quad HD display and the Vertex a Full HD display, one will apparently come with a Snapdragon 820, the other with a Snapdragon 652.

The QHD version of the Moto X will have 3GB or 4GB of RAM and 32GB of storage, the Full HD version will have 16GB of storage and 2GB of RAM or 32GB of storage and 3GB of RAM.

The cameras will be different on the two handsets, the Vector Thin will have a 16 megapixel camera and the Vortex a 13 megapixel camera, the Vector will have a 2600 mAh battery and the Vortex a 3500 mAh battery.

Both devices will apparently launch in June and it looks like they will be made official at Lenvo Tech World on the 9th of June.

Source Venture Beat

Filed Under: Android News, Mobile Phone News, Top News

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