Apple is expected to launch their new iPhone 7 and iPhone 7 Plus smartphones some time in September, we have already heard some details about the device and now we have some more information on the handsets design.
According to a recent report Apple’s iPhone 7 and 7 Plus will be thinner and lighter than the iPhone 6S and 6S Plus.
The handsets will apparently also come with larger batteries than the current devices and the company will use high tech packaging technology to the RF chip on the iPhone 7 and also Fan out Packaging technology, this will allow for the handsets to be made thinner and lighter.
We also heard a number of rumors previously about the new iPhones, which have included Apple ditching the 3.5mm audio jack on the handsets and using its lightning port for audio instead.
The handset is expected to come with a new Apple A10 processor and it will also get more RAM than the current devices. The iPhone 6S comes with 2GB of RAM and we are expecting the new iPhone 7 to come with at least 3GB of RAM, possibly 4GB.
Apple is expected to make its new iPhones official some time in September, as soon as we get some more details about the handsets we will let you guys know.
Source ET News, Le Journal Du Geek
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