This week VIA has launched its first ARM based computer-on-module (COM) in the form of the VIA QSM-8Q6 which is also the first COM to use the 70 x 70mm Qseven 2.0 form-factor.
Features of the new board include a Freescale i.MX6 DualLite SoC, 3-5W TDP processor that is clockable up to 1.0GHz supported by 2D and 3D graphics and video acceleration.
RAM takes the form of 2G DDR3-1066 SDRAM and storage is provided by a microSD socket and 4GB eMMC and 1x SATA II (optional; via 230-pin Qseven MXM connector). Other features include :
– Networking — gigabit Ethernet (via 230-pin Qseven MXM connector)
– Display (via 230-pin Qseven MXM connector):
– HDMI v1.4 interface
– LVDS — dual-channel 18/24-bit interface
– Other I/O (via 230-pin Qseven MXM connector):
– USB — 4x USB 2.0 Host ports; 1x OTG port
– 2x COM ports (TX/RX)
– 1x SDIO
– 1x I2C
– I2S audio
– 2x CAN bus
– SPI
– 1x GPIO
– 1x PCIe 2.0 x1 channel
– Other features (via on-board I/O connectors):
– RS232 serial debug port (in addition to the 2x COM ports on the Qseven bus)
– MIPI CSI-2 camera port
– Android buttons interface
• Operating temperature — -20 to 70°C
• Power — 5V; 3-5W typ. consumption
• Dimensions — 70 x 70mm; Qseven 2.0
Source: Linux Gizmos
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