SK Hynix has this week confirmed that mass production of the world’s first 128 layer 4D Nand 1TB TLC (Triple-Level Cell) 4D NAND Flash has started. The 128-Layer 1 Tb NAND chip offers the industry’s highest vertical stacking with more than 360 billion NAND cells, each of which stores 3 bits, per one chip.
“SK Hynix has secured the fundamental competitiveness of its NAND business with this 128-Layer 4D NAND,” said Executive Vice President Jong Hoon Oh, Head of Global Sales & Marketing. “With this product, with the industry’s best stacking and density, we will provide customers with a variety of solutions at the right time.”
SK Hynix Is planning to develop the for major smartphone applications during the first half of 2020. Being able to offer 128-Layer 1TB NAND Flash, the number of NAND chips necessary for a 1TB drive will be reduced by half, compared to 512 GB NAND. Offering consumers a mobile solution that requires 20% less power and measures just 1 mm in thickness.
“With the same 4D platform and process optimization, SK Hynix was able to reduce the total number of manufacturing processes by 5% while stacking 32 more layers on the existing 96-Layer NAND. As a result, the investment cost for the transition from 96-Layer to 128-Layer NAND has been reduced by 60% compared to the previous technology migration, significantly boosting investment efficiency.”
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