VIA has announced the availability of its new VIA Edge AI Developer Kit this week, which is now available to purchase in two configurations from the VIA Embedded online store. The first configuration consists of a VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board with 13MP CMOS Camera Module with specifications offering COB 1/3.06″ and a resolution of 4224 x 3136 pixels for $629 plus shipping. The second consists of a VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board for $569 plus shipping. There is also available and optional 10.1″ MIPI LCD touch panel, costing $179 plus shipping.
The VIA Edge AI Developer Kit combines the VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board with a 13MP camera module that is optimised for intelligent real-time video capture, processing, and edge analysis. “Edge AI application development is enabled by an Android 8.0 BSP, which includes support for the Snapdragon Neural Processing Engine (NPE) and full acceleration of the Qualcomm Hexagon DSP, Qualcomm Adreno 530 GPU, or Qualcomm Kryo CPU to power AI applications.”
VIA have also announced that a Linux BSP based on Yocto 2.0.3 is set to be released in June 2018, as soon as more information and full specifications are released we will keep you up-to-date as always but for now jump over to the official VIA for more information and purchasing options.