We’ve seen a reports in the past that Samsung may drop the Qualcomm Snapdragon 810 processor for its upcoming flagship device which is expected to come with the Galaxy S6 moniker. This is reportedly due to overheating issues Samsung came across while testing.
Another explanation could be that the Korean OEM is trying push its own Exynos chips with its devices. But, Qualcomm is still a big player when it comes to processors, and a new report suggest that they are trying to redesign the chipset to overcome the heating issues, and should have the chipset ready by March for Samsung.
There’s no word if it will be able to do that in time for a March release as Samsung has scheduled an event in early-March at MWC 2015 where the company is expected to unveil its next flagship device.
LG also used the Snapdragon 810 processor in the LG G Flex 2, and reported there are no overheating issues with the device which will launch in South Korea later this month. LG stated that it’s not just about the CPU, but also depends on the design of the handset to dissipate that heat.
Well, it remains to be seen what happens, we’ll update you if we get to hear more about it.
Source: PhoneArena
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