We have already seen some photos of the leaked casing for Apple’s iPhone 6S and heard a number of specifications on the device.
Now some leaked schematics for the iPhone 6 have been revealed by Engadget Japan, and id these are the real deal, the iPhone 6S will be slightly thicker than the iPhone 6.
The iPhone 6 measure 6.9mm thick, the leaked schematics, which can be seen below, show that the iPhone 6S will measure 7.10 mm thick.
The new iPhone 6S will share a similar design to the iPhone 6, the handset will come with a new faster LTE modem and also a new Apple A9 processor which is faster and provides improved graphics over the Apple A8 processor.
The 6S is rumored to feature a 4.7 inch display with a Full HD resolution of 1920 x 1080 pixels, it will also come with Apple’s Force Touch, a new fingerprint sensor, an updated Full HD FaceTime camera and a new 12 megapixel camera.
We are expecting Apple’s new iPhone handsets to launch in September along with iOS 9, as soon as we get some more details on the handsets, we will let you guys know.
Source Engadget Japan, Ubergizmo
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