IBM has this week announced that they are currently developing a new ultradense computer chip that will provide roughly four times the capacity of today’s most powerful chips.
IBM is investing $3 billion in a private-public partnership with the New York State, GlobalFoundries, Samsung and equipment vendors to develop the chips in New York’s Hudson Valley.
IBM’s new chips are currently in the research phase of development but it is hoped that the new IBM chips will aid semiconductor technology to continue to shrink in size through to at least 2018. Currently each generation of chip technology is defined by the minimum size of fundamental components that switch current at nanosecond intervals and the industry is currently moving from 14-nanometer to 10-nanometer manufacturing.
The new IBM chips will provide the ability for the technology to use faster transistor switching and lower power requirements and make it possible to build microprocessors with more than 20 billion transistors.
Visit the report by the New York Times for full details and specifications via the link below.
Source: NYT