Today Samsung announced that it has begun shipping samples of the industry’s highest-density memory, a 32GB module designed for advanced servers doubling the previous density with increased power yet reducing energy requirements.
The highly-efficient 32GB RDIMM consists of 36 dual-die 40nm-class 4Gb DDR3 chips that can perform at equal or greater levels to a 40nm-based 16GB RDIMM with no increase in power consumption.
Samsung is using the industries highest-density monolithic DDR3 device, a 40-nanometer (nm) class, four gigabit DDR3 chip as the building block for the new 32GB module and mass production of the chip is expected to start next month.
Via Akihabara News
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