G.Skill has announced that its new Extreme Low Latency DDR4-3600 CL14 64GB memory kits will soon be available to purchase and will be officially launching before the end of 2020. These kits will be available from worldwide distribution partners. The low latency performance memory specifications will support Intel XMP 2.0 for easy overclocking and will be available as DDR4-3600 CL14-15-15-35 in 64 GB (16GBx4) and 32 GB (16GBx2) configurations under the Trident Z Neo, Trident Z Royal, Trident Z RGB, and Ripjaws V series.
Enhanced Performance and Overclocking
The new memory kits are designed to cater to both enthusiasts and professionals who demand high performance and reliability. The support for Intel XMP 2.0 ensures that users can easily overclock their memory modules to achieve optimal performance without the need for extensive manual tuning. This feature is particularly beneficial for gamers, content creators, and professionals who require stable and high-speed memory for their applications.
“At G.SKILL, we are always searching for the ultimate memory kit, tuned not only for speed, but also for efficiency. And to achieve high efficiency, this means lower latency timings. As the market demand for higher capacity increases, G.SKILL has risen to the challenge, and is introducing the DDR4-3600 CL14-15-15-35 64 GB (16 GB x4) memory kit specification, shown validated on the Intel-based ASUS ROG MAXIMUS XII HERO (WI-FI) Z490 and MSI MEG Z490 GODLIKE motherboards, as well as the AMD-based ASUS PRIME X570-P motherboard.”
High-Performance Samsung B-die ICs
Once again, the memory kits have been manufactured using high-performance Samsung B-die ICs to achieve the low latency of CL14 at DDR4-3600, says G.Skill. Samsung B-die ICs are renowned for their superior performance and overclocking capabilities, making them a popular choice among memory manufacturers and enthusiasts. These ICs allow for tighter timings and higher frequencies, which translate to better overall system performance.
The use of Samsung B-die ICs also ensures that the memory kits can maintain stability and reliability even under heavy workloads. This is crucial for users who run memory-intensive applications such as video editing, 3D rendering, and large-scale simulations. The combination of low latency and high capacity makes these memory kits an excellent choice for both gaming and professional use.
Compatibility and Aesthetic Options
The new DDR4-3600 CL14 memory kits are compatible with a wide range of motherboards, including the Intel-based ASUS ROG MAXIMUS XII HERO (WI-FI) Z490 and MSI MEG Z490 GODLIKE, as well as the AMD-based ASUS PRIME X570-P. This broad compatibility ensures that users can easily integrate the memory kits into their existing systems without any compatibility issues.
In addition to performance, G.Skill has also focused on aesthetics. The memory kits are available under the Trident Z Neo, Trident Z Royal, Trident Z RGB, and Ripjaws V series, offering a variety of designs to match different build themes. Whether you prefer the sleek and modern look of the Trident Z Neo, the luxurious design of the Trident Z Royal, the vibrant RGB lighting of the Trident Z RGB, or the classic appearance of the Ripjaws V, there is a memory kit to suit your style.
G.Skill’s new Extreme Low Latency DDR4-3600 CL14 64GB memory kits represent a significant advancement in memory technology. With their low latency, high capacity, and support for Intel XMP 2.0, these kits are designed to meet the needs of both enthusiasts and professionals. The use of high-performance Samsung B-die ICs ensures that the memory kits deliver exceptional performance and reliability, making them an excellent choice for a wide range of applications.
As the demand for higher capacity and better performance continues to grow, G.Skill remains committed to pushing the boundaries of memory technology. The upcoming launch of these memory kits is a testament to their dedication to innovation and excellence in the field of computer memory.
Source: G.Skill
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